All Tensor chipsets so far and the upcoming Tensor G4 are based on Exynos chips and made by Samsung. But Google has been working on it your own design and will reportedly distance itself from Samsung's foundries.
A trading record provides the first evidence that the Tensor G5 will instead be manufactured by TSMC. If all goes well, the G5 will be used in the Pixel 10 series at the end of 2025. This information was discovered by Android Authoritywho created this handy chart to explain all the abbreviations:
This is where the information comes from, shipping details for G5 chips for testing. Please note that A0 is the first step, so it will be tested for issues and not for what will be in retail units (it will take at least a year to get to that point). Also note the name Tessolve – the company describes itself as an “provider of end-to-end solutions, from chip design, testing and PCB engineering”.
The first evidence that the Tensor G5 will be made by TSMC
Google has not completely turned away from Samsung, the 16 GB RAM is manufactured by Samsung Electronics Co. (i.e. SEC). The Pixel 9 series would be the first generation have a RAM option of 16 GB (series 8 and earlier maxed out at 12 GB).
Why is the chipset so closely linked to RAM? That's because of “InFO_PoP”, i.e. Integrated Fan-Out Package on Package, which is TSMC technology for grafting RAM on top of the chipset:
InFO_PoP allows for thinner packaging (in this case 1.16 mm) and also has improved electrical and thermal properties.
The Tensor G4, which will be released later this year, promises that better thermal management and energy efficiency then the G3. Whether or not that works out, the G5 is a major redesign, so the G4's performance may mean very little in terms of how the G5 will do.